Deskripsi Pekerjaan
Join A*STAR's pioneering research division at the Institute of Microelectronics (IME) to revolutionize semiconductor packaging through advanced Chip-to-Wafer (C2W) bonding technologies. This role offers an unparalleled opportunity to lead cutting-edge research in heterogeneous integration, where you'll develop next-generation solutions for 3D IC integration, advanced interconnects, and multi-material systems. Our collaborative environment fosters innovation through cross-functional partnerships with leading material scientists, process engineers, and device architects. You'll work with state-of-the-art cleanroom facilities and contribute to projects that directly impact Singapore's semiconductor ecosystem and global microelectronics advancement.
As part of our dynamic research team, you'll tackle complex challenges in thermal management, stress mitigation, and high-density interconnects while driving breakthroughs in packaging scalability and performance. We provide comprehensive resources for experimental validation, computational modeling, and prototyping, ensuring your research translates into tangible technological impact. This position offers competitive remuneration, professional development opportunities, and the chance to publish high-impact research in top-tier journals and conferences.
Tanggung Jawab
- Lead R&D initiatives in C2W bonding technologies for heterogeneous integration systems
- Design, execute, and optimize bonding processes for advanced semiconductor packaging applications
- Collaborate with cross-functional teams to develop innovative material solutions for interconnect reliability
- Characterize bonding interfaces using advanced metrology techniques (SEM, TEM, AFM)
- Develop process flows for high-precision alignment and bonding of dissimilar materials
- Drive technology transfer from research to manufacturing through process optimization
- Secure intellectual property through patents and contribute to technical publications
- Mentor junior researchers and supervise graduate student projects
Kualifikasi
- PhD in Materials Science, Electrical Engineering, Chemical Engineering, or related field
- 5+ years of hands-on experience in semiconductor packaging or microfabrication
- Expertise in wafer bonding techniques (thermo-compression, adhesive, anodic)
- Strong background in heterogeneous integration and 3D IC architectures
- Proficiency in FEA modeling for stress/strain analysis in bonded structures
- Demonstrated ability to publish peer-reviewed research or secure patents
- Experience with cleanroom operations and semiconductor process equipment
- Excellent problem-solving skills and innovative mindset