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Engineering 🏢 Full Time ⭐️ Terverifikasi

Electrical Failure Analysis Engineer – NAND Technology

Micron Semiconductors
Singapore
Estimasi Gaji
SGD 80.000 – SGD 120.000
Live Update
29 Mei 2026
Batas Akhir
29 Mei 2027

Deskripsi Pekerjaan

Join Micron Semiconductors' pioneering team as an Electrical Failure Analysis Engineer specializing in NAND technology. This critical role drives innovation in semiconductor reliability by identifying root causes of electrical failures and developing advanced failure analysis methodologies. You'll work at the forefront of memory technology, collaborating with cross-functional teams to enhance yield and product quality. Ideal candidates thrive in dynamic R&D environments and possess deep expertise in electrical characterization techniques. Position offers competitive compensation, comprehensive benefits, and opportunities to impact next-generation storage solutions. Be part of a global leader committed to pushing the boundaries of semiconductor innovation.

Tanggung Jawab

  • Conduct comprehensive electrical failure analysis on NAND memory devices using advanced microscopy and probing techniques
  • Develop and implement innovative FA methodologies for complex memory array failures
  • Collaborate with design and process engineering teams to drive yield improvement initiatives
  • Document detailed failure reports with root cause analysis and corrective action recommendations
  • Stay current with emerging FA technologies and semiconductor reliability standards
  • Mentor junior engineers on FA best practices and semiconductor characterization tools
  • Support new product introductions through early-stage failure analysis validation

Kualifikasi

  • Bachelor's degree in Electrical Engineering, Materials Science, or related field (Master's preferred)
  • Minimum 5 years of experience in semiconductor failure analysis, preferably with NAND memory
  • Expertise in electrical characterization tools (e.g., curve tracer, SMU, parametric testing)
  • Strong knowledge of semiconductor device physics and memory array architecture
  • Proficiency in microscopy techniques (SEM, TEM, FIB) and material analysis methods
  • Experience with statistical process control (SPC) and yield improvement methodologies
  • Excellent problem-solving skills and ability to work in cross-functional teams

Keahlian yang Dibutuhkan

Electrical Failure Analysis NAND Technology FA Methodologies Yield Improvement Semiconductor Engineering Electrical Characterization SEM/TEM FIB Root Cause Analysis SPC

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